What packaging technologies are included in the LED fine-pitch display?
At present, LED small-pitch display screens have become indispensable display devices in many industries. Whether it is the application of upstream chips, mid-stream packaging, and downstream packaging, the high use of small-pitch screens is indispensable. It is no exaggeration to say: LED small-pitch screens play a vital role in packaging in the display industry. In 2020, it will enter the development stage of micro-pitch. The development of small-pitch displays has become the reform of many LED display companies. important part of. Understanding the various packaging technologies of small-pitch screens has become the key to product quality assurance, so what packaging technologies are included in LED small-pitch screens? The following points can be considered.
1. SMD surface mount
SMD surface mount packaging technology has always been one of the important technologies of LED display. It consists of single or multiple LED chips soldered on a metal bracket with a plastic “cup” frame. Then, liquid epoxy resin or organic silica gel is potted in the plastic outer frame, and finally baked at high temperature to form, and then cut and separated into a single surface-mount packaged device after completion.
2. LED packaging technology
Dehao Ruituo’s LED packaging technology is a method of adhering the bare chip to the LED substrate with conductive or glue, followed by LED lead bonding to realize the electrical connection of the LED box. The LED package adopts integrated packaging technology, which can save a single LED device, and then package it and then the patch process, so that it can effectively solve the SMD package display. Later, because the dot pitch of the small-pitch screen is continuously reduced, the difficulty of the process technology will become more and more difficult, and the difficulty of reducing the cost will be more and more difficult. At this time, the use of LED packaging technology will make it easier to achieve small pitch.
3. Packaging technology IMD four-in-one
IMD’s new packaging technology is the technology accumulation of SMD placement by LED small-pitch display manufacturers, and the four-in-one is an upgraded version of the Internet based on the inheritance of SMD packaging. We all know that the SMD package contains one pixel in one structure, and the four-in-one package contains four pixels in one structure, which is four times higher. Although the four-in-one LED screen adopts the new integrated packaging technology IMD, its process is still the same as the surface mount process, which solves various problems such as color difference consistency, seams, light leakage, and maintenance. The four-in-one LED module uses a formal chip. As the packaging manufacturers make more requirements for the chip, various solutions of “six-in-one” or even “N-in-one” may be launched in the later stage, in order to better Save money for LED screen companies and purchasers.
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